Teradyne identified the measurement and data-processing demands of high-density light-emitting devices, together with simultaneous electrical and optical performance evaluation, as key challenges in MicroLED mass-production testing.
Reporting & Analysis: UBI Research
Editor: Choonghoon YI, CEO & Chief Analyst
On September 17, Teradyne presented ‘Challenges of MicroLED Testing’ on the second day of MicroLED Connect 2026 in Eindhoven, the Netherlands. According to the final official schedule, the presentation began at 11:10 a.m. local time, or 6:10 p.m. in Korea.
Teradyne’s published abstract explains that measurement and data-processing complexity increases as more light-emitting devices are integrated on a single wafer. The density of MicroLED devices itself places a direct burden on test equipment and analysis workflows.

Teradyne’s UltraFLEXplus semiconductor automated test platform. Source: Teradyne official website
MicroLEDs for AR and VR also require additional test conditions. Teradyne cited low optical efficiency when light is coupled into a waveguide and the need to evaluate performance in a way that reflects human visual perception.
Testing is not limited to electrical characteristics. The published abstract also addresses accurate electrical and optical measurements across large device populations and methods for improving measurement consistency.
At the mass-production stage, throughput, repeatability and yield optimization were identified as important requirements. Teradyne included test methods scalable to high-volume production within the scope of its presentation.
On the same day, TechnoTeam covered metrology lenses for near-eye displays and quality assurance for AR and XR, while Konica Minolta addressed virtual-image mura correction for AR and VR displays. The program extended the MicroLED testing discussion from individual-device measurement to optical-quality evaluation of complete displays.
Taken together, the event program and Teradyne’s published abstract show that MicroLED mass-production testing now requires not only measurement accuracy but also consistent processing of enormous volumes of device data.
Source: MicroLED Connect official event page · TechBlick official agenda announcement, June 30, 2026 · Teradyne official presentation abstract · Teradyne UltraFLEXplus product page
